Hoʻolauna TEM

ʻO Transmission Electron Microscope (TEM) kahi ʻenehana kālailai microphysical structure e pili ana i ka microscopy electron e pili ana i ka uila uila ma ke kumu māmā, me ka hopena kiʻekiʻe ma kahi o 0.1nm.ʻO ka puka ʻana o ka ʻenehana TEM ua hoʻomaikaʻi maikaʻi loa i ka palena o ka nānā ʻana o ke kanaka me ka ʻike maka ʻole o nā hale microscopic, a he mea pono ʻole ka nānā ʻana i ka microscopic i loko o ke kahua semiconductor, a he mea pono hoʻi no ka noiʻi kaʻina hana a me ka hoʻomohala ʻana, ka nānā ʻana i ke kaʻina hana nui, a me ke kaʻina hana. anomaly ana i ka semiconductor kahua.

Loaʻa i ka TEM kahi ākea ākea o nā noi ma ke kahua semiconductor, e like me ka wafer manufacturing process analysis, chip failure analysis, chip reverse analysis, coating and etching semiconductor process analysis, etc. nā hui hoʻolālā chip, ka noiʻi a me ka hoʻomohala ʻana i nā lako semiconductor, ka noiʻi waiwai a me ka hoʻomohala ʻana, nā keʻena noiʻi kulanui a pēlā aku.

ʻO GRGTEST TEM ka hoʻolauna ʻana i ka hiki ke kime
Ke alakaʻi ʻia nei ka hui ʻenehana TEM e Kauka Chen Zhen, a ʻo ka iwi kuamoʻo o ka hui i ʻoi aku ma mua o 5 mau makahiki o ka ʻike ma nā ʻoihana pili.ʻAʻole wale lākou i loaʻa i ka ʻike waiwai i ka ʻike ʻana i ka hopena TEM, akā ʻo ka ʻike waiwai hoʻi i ka hoʻomākaukau ʻana i ka laʻana FIB, a loaʻa iā lākou ka hiki ke nānā i ka 7nm a ma luna o nā wafers kaʻina hana kiʻekiʻe a me nā hale kī o nā mea semiconductor like ʻole.I kēia manawa, ʻo kā mākou mea kūʻai aku ma luna o nā hale laina mua o ka home, nā hale hana hoʻopihapiha, nā ʻoihana hoʻolālā chip, nā kulanui a me nā keʻena noiʻi ʻepekema, etc., a ua ʻike nui ʻia e nā mea kūʻai.