ʻO ka hoʻomaka ʻana i ka microscopy electron scanning beam pālua (DB-FIB)

ʻO nā lako koʻikoʻi no nā ʻenehana microanalysis ʻo ia hoʻi: microscopy optical (OM), double-beam scanning electron microscopy (DB-FIB), scanning electron microscopy (SEM), a me transmission electron microscopy (TEM).ʻO ka ʻatikala o kēia lā e hoʻolauna i ke kumu a me ka hoʻohana ʻana o DB-FIB, e kālele ana i ka hiki ke lawelawe o ka lekiō a me ke kīwī metrology DB-FIB a me ka noi ʻana o DB-FIB i ka nānā ʻana semiconductor.

He aha ka DB-FIB
ʻO ka lua-beam scanning electron microscope (DB-FIB) he mea hana e hoʻohui i ka ion beam a me ka scanning electron beam ma hoʻokahi microscope, a ua hoʻolako ʻia me nā lako e like me ke kinoea injection system (GIS) a me ka nanomanipulator, i mea e hoʻokō ai i nā hana he nui. e like me ka etching, ka waiho ʻana i nā mea, ka micro a me ka hana nano.
Ma waena o lākou, hoʻolalelale ʻia ka kukuna ion i hoʻopaʻa ʻia (FIB) i ka kukuna ion i hana ʻia e ka puna wai gallium metala (Ga), a laila e kālele ana i ka ʻili o ka hāpana e hana i nā hōʻailona electron lua, a ʻohi ʻia e ka mea ʻike.A i ʻole e hoʻohana i ka kukuna ion ikaika o kēia manawa no ke kālai ʻana i ka ʻili hoʻohālike no ka hana micro a nano;Hiki ke hoʻohana ʻia ka hui pū ʻana o ke kino sputtering a me ke kinoea kinoea e koho ai a waiho i nā metala a me nā insulators.

Nā hana nui a me nā noi o DB-FIB
Nā hana nui: ka hoʻoponopono ʻana i ka ʻāpana ʻāpana paʻa, ka hoʻomākaukau ʻana o ka laʻana TEM, koho a hoʻonui ʻia paha, ka waiho ʻana i nā mea metala a me ka waiho ʻana o ka papa insulating.
Kahua noi: Hoʻohana nui ʻia ʻo DB-FIB i nā mea seramika, polymers, nā mea metala, biology, semiconductor, geology a me nā ʻano noiʻi ʻē aʻe a me nā hoʻāʻo huahana pili.ʻO ka mea nui, hiki ke hoʻololi ʻia ka hiki ke hoʻomākaukau ʻana i ka laʻana hoʻoili paʻa paʻa o DB-FIB.

ʻO GRGTEST DB-FIB hiki ke lawelawe
ʻO ka DB-FIB i kēia manawa i hoʻolako ʻia e ka Shanghai IC Test and Analysis Laboratory ʻo ia ka Helios G5 series o Thermo Field, ʻo ia ka moʻo Ga-FIB kiʻekiʻe loa ma ka mākeke.Hiki i ka moʻo ke hoʻokō i ka scanning electron beam imaging resolutions ma lalo o 1 nm, a ʻoi aku ka maikaʻi ma ke ʻano o ka hana ion beam a me ka automation ma mua o ka hanauna o mua o ʻelua-beam electron microscopy.Hoʻolako ʻia ka DB-FIB me nā nanomanipulators, nā ʻōnaehana injection gas (GIS) a me ka ikehu spectrum EDX e hoʻokō i nā ʻano like ʻole a me ka holomua semiconductor hemahema e pono ai.
Ma ke ʻano he mea hana ikaika no ka nānā ʻana i ka hemahema o ka waiwai kino semiconductor, hiki iā DB-FIB ke hana i ka mīkini ʻāpana ʻāpana paʻa me ka pololei nanometer.I ka manawa like o ka hana FIB, hiki ke hoʻohana ʻia ka scanning electron beam me ka nanometer resolution e nānā i ka microscopic morphology o cross-section a nānā i ka haku mele i ka manawa maoli.Loaʻa i ka waiho ʻana o nā mea metala like ʻole (tungsten, platinum, a me nā mea ʻē aʻe) a me nā mea non-metallic (carbon, SiO2);Hiki ke hoʻomākaukau ʻia nā ʻāpana ultra-thin TEM ma kahi kikoʻī, hiki ke hoʻokō i nā koi o ka nānā ʻana i ka hoʻonā kiʻekiʻe kiʻekiʻe ma ka pae atomic.
E hoʻomau mākou i ka hoʻopukapuka ʻana i nā lako microanalysis uila holomua, e hoʻomaikaʻi mau a hoʻonui i nā hiki pili i ka nānā ʻana i ka hemahema semiconductor, a hāʻawi i nā mea kūʻai aku i nā hāʻina kikoʻī a piha hoʻi.