E uhi ana i nā kikohoʻe nui, analog, digital-analog hybrid a me nā ʻano chip ʻē aʻe.
● CP hoao lako lako manao
ʻO ka ʻenehana hoʻāʻo he kāleka pin, hoʻohana ʻia no ka pilina kino ma waena o ATE a me DIE.
● FT hoao lako lako manao
ʻO ka lako hoʻāʻo ʻo ka loadboard+socket+changekit, i hoʻohana ʻia no ka hoʻāʻo ʻana i ka pilina kino ma waena o nā lako a me ka chip i hoʻopaʻa ʻia.
● hōʻoia pae-papa
No ke kūkulu ʻana i kahi kaiapuni hana chip "simulated", e hoʻāʻo i ka hana chip a i ʻole e nānā inā hiki i ka chip ke hana maʻamau i nā ʻano ʻino like ʻole.
● hoʻāʻo SLT
ʻO kahi hana hoʻāʻo i ka ʻōnaehana ʻōnaehana e ʻike i ka maikaʻi, a me kahi ala hoʻohui o FT, ka mea nui no nā polokalamu SOC.
ʻO ka Integrated Circuit Testing and Analysis Division he alakaʻi i ka loiloi maikaʻi semiconductor home a me ka hoʻomaikaʻi ʻana i ka pono o ka papahana ʻenehana lawelawe lawelawe, ua hoʻopukapuka ʻoi aku ma mua o 300 kiʻekiʻe kiʻekiʻe o ka hoʻāʻo ʻana a me nā lako loiloi, hoʻokumu i kahi pūʻulu talena me nā kauka a me nā loea e like me ke kumu, a hana 8 nā hoʻokolohua kūikawā.Hāʻawi ia i ka nānā ʻana i ka hemahema ʻoihana a me ka hana wafer-level no nā ʻoihana i ka hana o nā lako hana, nā kaʻa, nā uila uila a me ka ikehu hou, nā kamaʻilio 5G, nā mea optoelectronic a me nā sensor, nā kaʻa kaʻa a me nā lako, a me nā mea hana.ʻO ka loiloi kaʻina hana, ka nānā ʻana i nā ʻāpana, ka hoʻāʻo ʻana i ka hilinaʻi, ka loiloi ʻana i ka maikaʻi o ke kaʻina hana, ka hōʻoia huahana, ka loiloi ola a me nā lawelawe ʻē aʻe e kōkua i nā ʻoihana e hoʻomaikaʻi i ka maikaʻi a me ka hilinaʻi o nā huahana uila.
Hiki ke hoʻololi i kā mākou mau kumukūʻai ma muli o ka lako a me nā kumu mākeke ʻē aʻe.E hoʻouna mākou iā ʻoe i kahi papa inoa kūʻai hou ma hope o ka hoʻopili ʻana o kāu hui iā mākou no ka ʻike hou aku.