Kinohi Kino Hoʻopōʻino
Hoʻolauna lawelawe
Hāʻawi ʻo GRGT i ka nānā kino kino (DPA) o nā ʻāpana e uhi ana i nā ʻāpana passive, nā mea ʻokoʻa a me nā kaapuni i hoʻohui ʻia.
No nā kaʻina hana semiconductor kiʻekiʻe, hiki i ka DPA ke uhi i nā chips ma lalo o 7nm, hiki ke hoʻopaʻa ʻia nā pilikia ma ka papa chip kikoʻī a i ʻole ka laulā um;no nā ʻāpana hoʻopaʻa ea pae aerospace me nā koi hoʻomalu o ka mahu wai, hiki ke hana ʻia ka PPM-level i loko o ka hoʻopili ʻana i ka wai mahu wai i loko e hōʻoia i nā koi kūikawā o nā ʻāpana hoʻopaʻa ea.
Laa lawelawe
Nā pahu kaapuni i hoʻohui ʻia, nā ʻāpana uila, nā mea ʻokoʻa, nā mea electromechanical, nā kaula a me nā mea hoʻohui, microprocessors, programmable logic device, memory, AD/DA, bus interfaces, general digital circuits, analog switch, analog device, microwave Devices, power supplies, etc.
Nā kūlana hoʻāʻo
● GJB128A-97 Semiconductor discrete mīkini hana ho'āʻo
● GJB360A-96 uila a me nā ʻāpana uila ke ʻano hoʻāʻo
● GJB548B-2005 Microelectronic nā ʻano hoʻāʻo a me nā kaʻina hana
● GJB7243-2011 Nā Koina ʻenehana no nā ʻāpana uila koa
● GJB40247A-2006 Ke Kaʻina Hana Kino Kino Hoʻopōʻino no nā ʻĀpana Electronic Koa.
● QJ10003—2008 Ke alakaʻi hōʻike no nā mea i lawe ʻia mai
● MIL-STD-750D semiconductor discrete mīkini hana hoʻāʻo
● MIL-STD-883G nā ʻano hoʻāʻo a me nā kaʻina hana microelectronic
Nā mea ho'āʻo
| ʻAno hoʻāʻo | Nā mea ho'āʻo |
| Nā mea luku ʻole | Ka nānā ʻana i waho, ka nānā ʻana i ka X-ray, PIND, ka hoʻopaʻa ʻana, ka ikaika hope, ka nānā ʻana i ka microscope acoustic |
| Mea luku | Laser de-capsulation, kemika e-capsulation, ka nānā ʻana i ke kinoea i loko, ka nānā ʻana i loko, ka nānā ʻana SEM, ka ikaika hoʻopaʻa, ka ikaika shear, ka ikaika adhesive, ka delamination chip, ka nānā ʻana i ka substrate, PN junction dyeing, DB FIB, ʻike ʻia nā wahi wela, kūlana leakage ʻike, ʻike lua, hoʻāʻo ESD |
